OYAMA, JAPAN -- Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it has delivered an excimer laser for semiconductor advanced packaging to a Japanese company engaged in research and development of advanced semiconductors, and the installation of the system was successfully completed in November.

Gigaphoton has applied its expertise in semiconductor lithography lightsources to develop a lightsource for ultra-fine ablation processing for advanced packaging processes.

The G300K is an excimer laser based on KrF (248nm) wavelength, which is integrated into the processing equipment for semiconductor package substrates. It provides high power, high repetition rate, high reliability with long life modules. The excimer laser is primarily used in the process of creating micro-via holes with a diameter of 10μm or less, as well as trench patterns. It is expected to be adopted for the manufacturing of 2.5D/3D packages utilizing chiplets, which are projected to increase and primarily used for AI chipsets.

Gigaphoton’s G300K has been integrated into the processing equipment manufactured by ORC MANUFACTURING CO., LTD.
The processing results and relevant outputs will be showcased at the exhibition held alongside SEMICON Japan 2025, starting December 17, 2025.

Tatsuo Enami, President and CEO of Gigaphoton said, "In Gigaphoton, alongside our research and development of lightsources for semiconductor lithography, we have also been exploring various possibilities for the application of excimer lasers in other fields.
We will continue to accelerate our research and development efforts to expand into new areas.
As a critical lightsource manufacturer in the semiconductor manufacturing industry, we will continue to contribute to the industry through continuous research and development on new processes to facilitate the further implementation of excimer lasers."