2026³â 05¿ù 15ÀÏ ±Ý¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Science & Technology

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýȰ

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óǰ

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC¡¯s 28nm SST eFlash

´º½ºÀÏÀÚ: 2026-05-15

HSINCHU, TAIWAN -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced its IP solutions on the UMC’s 28nm platform with SST-ESF4 eNVM, designed to enable next-generation MCU and AIoT SoCs targeting endpoint AI applications. The comprehensive IP solution integrates SST eFlash controller and BIST, together with silicon-proven analog and high-speed interface PHY IPs, providing a stable and production-ready foundation for low-power, high-performance endpoint AI designs.

Built on Faraday’s extensive 28nm design and silicon experience, the IP solutions go beyond IP delivery to offer end-to-end eFlash enablement, including characterization, verification, test-chip support, and production readiness. By consolidating peripheral and analog IPs, such as SRAM, USB, PLL, ADC/DAC, RTC library, temperature sensor, OSC and generic IO, etc. Faraday helps customers enhance test coverage, improve manufacturing yield, and accelerate production ramp-up. The solution also extends Faraday’s proven success from 55nm SST to 28nm SST, enabling a smooth, low-risk transition with improved performance and power efficiency.

“Endpoint AI applications require fast boot, reliable on-chip non-volatile memory, and highly efficient power-performance balance,” said Flash Lin, COO of Faraday Technology. “With our 28nm SST-ESF4 eFlash solutions and decades of eNVM expertise, Faraday provides customers with a scalable, manufacturable, and silicon-proven solution that significantly reduces development risk while accelerating time-to-market for AIoT and industrial edge SoCs.”



 Àüü´º½º¸ñ·ÏÀ¸·Î

IFF Expands Latin American Footprint With New Enzyme Hub, Brazil Application Lab
Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC¡¯s 28nm SST eFlash
Galderma Debuts Alastin Regenerating Skin Nectar With TriHex+, Advancing Next-Gen TriHex Technology Regenerative Platform
TestMu AI and Quarks Technosoft Partner to Power the Next Era of Autonomous Quality Engineering
Skild AI Acquires Zebra Technologies¡¯ Robotics Automation Business
Advanced Energy Debuts LPP200 Low-Profile AC-DC Supplies Driving Miniaturization in Medical and Industrial Devices
Ridi¡¯s Manta Expands into Manga to Build a Comprehensive Story Ecosystem

 

Omdia Raises 2026 Semiconductor Forecast to 62.7% as AI Drives Global ...
IQM and Real Asset Acquisition Corp. File Confidential Draft Form F-4 ...
Experian Awarded Best Overall Strategy in Chartis¡¯ Inaugural Retail B...
Airship Expands Industry-first AI Agent Fleet, Bringing Goal Optimizat...
Invivoscribe Unveils PrepQuant System to Standardize and Streamline Pr...
70% of Enterprise AI is Uncontrolled, Driving Hidden Risk, Cost and Sl...
Sitetracker Launches Scout, an Agentic AI Platform Purpose-Built for C...

 


°øÁö»çÇ×
'º£³×ÀÍ' Áß¹® Ç¥±â 宝Ò¬ìÌ, 'À̺ñÁî: ÀÌÁö' Áß¹® Ç¥±â æ¶币òª...
¿¡³ÊÀ¯ Enereu 额Òö äþÒö
¾Ë¸®¾Ë Allial Áß¹® Ç¥±â ä¹××尔 ä¹××ì³
´º½ºÁö Áß¹®Ç¥±â´Â À½Â÷ Ç¥±â¹æ½Ä '纽ÞÙó¢ ´Ï¿ì½ºÁö'
¹Ìµð¾î¾Æ¿ì¾î Mediaour ØÚ体ä²们 ØÚô÷ä²Ùú MO ¿¥¿À ØÚä² ØÚä²
¾Ë¸®À¯ºñ Alliuv ä¹备: ä¹êó备, ¾Ë¶ã Althle ä¹÷åìÌ
´ºÆÛ½ºÆ® New1st Áß¹® Ç¥±â 纽ììãæ(¹øÃ¼ Òïììãæ), N1 纽1
¿£ÄÚ½º¸ð½º : À̾¾ 'EnCosmos : EC' Áß¹® Ç¥±â ì¤ñµ
¾ÆÀ̵ð¾î·Ð Idearon Áß¹® Ç¥±â ì¤îè论 ì¤îèÖå
¾ËÇÁ·Ò Alfrom Áß¹® Ç¥±â ä¹尔ÜØ ä¹ì³ÜØ
´º½º±×·ì Á¤º¸ ¹Ìµð¾î ºÎ¹® »óÇ¥µî·Ï
¾ËÇÁ·Ò °è¿­ »óÇ¥, »óÇ¥µî·Ï ¿Ï·á

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇѰè¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, ÆÑ½º 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..