2025³â 01¿ù 20ÀÏ ¿ù¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Science & Technology

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýÈ°

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óÇ°

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

Tongxin Micro Making a Splash at TRUSTECH, and Unveiling the World¡¯s First eSIM Solution Tailored for Smart POS Systems

´º½ºÀÏÀÚ: 2023-12-01

PARIS-- November 28th marks the grand opening of TRUSTECH 2023 in Paris, France. Tongxin Micro, an industry-leading semiconductor solution provider, makes an impressive debut, showcasing its technological advancements in identity recognition, telecommunications, and financial payments.

In the realm of identity recognition, Tongxin Micro brings its document chip solutions in compliance with international ICAO standards that boast the highest security levels globally, catering to such applications as seafarer’s passport and official passport. In telecommunications, a full array of products and terminal applications are displayed, including standard SIM, SWP-SIM, digital car keys based on SWP-SIM, and eSIM wearable devices. In the payment sector, Tongxin Micro’s innovative payment technologies draw significant attention, ranging from chip applications in payment IC cards, display cards, fingerprint cards, and e-CNY hardware wallets, to MCU chips for safety-critical products, such as POS, online identity authentication, IoT SE, and biometric identification.

In addition, John Zou, EVP of Tongxin Micro, shares the world’s first eSIM solution tailored for smart POS systems at the Innovation Stage. He expresses that, “Currently, smart POS systems require to switch among multiple SIM cards to connect to different networks, which is a tedious and unsafe process, and thus compromising business service efficiency and user experience. Our solution, designed with the world-class security chips in an embedded manner, features high information security. It enables online activation of eSIM, allowing the switch between different carriers freely to save deployment costs. This solution comes with wafer-level personalization services, saving significant board-level space, and we can also provide customized one-stop solutions to meet the diverse needs of customers both at home and abroad.” To date, this solution has been adopted by several well-known terminal device manufacturers.

Bearing its mission of achieving more intelligent, more convenient, and more secure digital experience in mind, Tongxin Micro has deepened its footprint in the fields of automotive electronics and smart chip. The company is steadily accelerating its global expansion, with business spanning over twenty countries and regions in Asia, Europe, Americas, and Africa. Tongxin Micro looks forward to continuously creating more competitive new technologies and solutions for global customers, and jointly forging ahead for a brighter future in digital economy.



 Àüü´º½º¸ñ·ÏÀ¸·Î

Quectel Unveils Ultra-Compact 5mm x 5mm x 1.05mm LS550G GNSS Module for Positioning in Low-Power Applications
LambdaTest Transforms Visual Testing with the Introduction of New Features in the SmartUI Visual AI Engine for Flawless Digital Experiences
Biocytogen Announces Licensing of Fully Human Antibodies with SOTIO
BOSTON ONCOLOGY ARABIA and SPIMACO Partner to Localize Advanced Oral Oncology Treatments in Saudi Arabia
Mesmerise to collaborate with Mayo Clinic to Transform Medical Education and Healthcare Workforce Training
Zepp Health to Showcase Groundbreaking Innovations at CES Pepcom & ShowStoppers Media Events
Making Science launches RAISING, its new AI technology division to power marketing strategies

 

VeriSilicon¡¯s Display Processing IP DC8200-FS has Achieved ISO 26262 ...
Riskified and Appriss Retail Announce Pioneering Omnichannel Returns F...
Smart Communications Named a Leader in IDC MarketScape Reports for Int...
SPIE, the International Society for Optics and Photonics, Announces It...
GIGABYTE Demonstrates Omni-AI Capabilities at CES 2025: Comprehensive ...
IntelliVIX Unveils Next-Generation Generative AI Monitoring Platform ...
Driving HVAC Innovation for a Smarter, More Efficient Future

 


°øÁö»çÇ×
´º½ºÁö ÇÑÀÚÇ¥±â 'ãæÚ¤ó¢'
´º½º±×·ì Á¤º¸ ¹Ìµð¾î ºÎ¹® »óÇ¥µî·Ï
¾ËÇÁ·Ò °è¿­ »óÇ¥, »óÇ¥µî·Ï ¿Ï·á
¾Ë¶ã°Ç¼³, »óÇ¥µî·Ï ¿Ï·á
Á¸Â÷´åÄÄ, ±Û²Ã º¯°æ »óÇ¥µî·Ï ¿Ï·á

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æħ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇÑ°è¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, Æѽº 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..