2025³â 11¿ù 20ÀÏ ¸ñ¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Business

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýȰ

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óǰ

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

VeriSilicon Launches the Industry-Leading Automotive-Grade Intelligent Driving SoC Design Platform

Providing one-stop custom service from chip design and verification to automotive-grade certification
´º½ºÀÏÀÚ: 2025-05-09

SHANGHAI -- VeriSilicon (688521.SH) announced that its automotive-grade high-performance intelligent driving system-on-chip (SoC) design platform has been verified and successfully implemented in customer projects. Leveraging VeriSilicon’s Silicon Platform as a Service (SiPaaS) business model, this platform provides robust technical support for high-performance computing applications such as autonomous driving and advanced driver assistance systems (ADAS).

VeriSilicon’s chip design process has obtained ISO 26262 automotive functional safety management system certification, enabling the company to provide global customers with one-stop custom service for their automotive chips that meet functional safety requirements. Combined with its extensive portfolio of automotive-grade IPs and complete intelligent driving software platform, VeriSilicon offers end-to-end support from chip design and verification to automotive certification, including safety requirement analysis, architecture design, and certification assistance.

The newly launched automotive-grade high-performance intelligent driving SoC design platform adopts a flexible, configurable architecture, supporting efficient collaboration among multiple co-processors, including high-performance multi-core Central Processing Units (CPUs), image signal processors, video codecs, and neural network processors. The platform can be optionally equipped with a built-in ASIL D-level functional safety island developed by VeriSilicon. It also supports a high-speed, high-bandwidth memory subsystem that features excellent data throughput and real-time processing capabilities. Optimized for advanced automotive-grade process nodes, including 5nm and 7nm, this platform delivers outstanding power, performance, and area (PPA) characteristics.

“The intelligent vehicles industry is advancing rapidly, and VeriSilicon’s automotive-grade SoC design platform balances performance, safety, and design flexibility, empowering automakers to swiftly address market demands,” said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. “With over a decade of expertise in the automotive industry, VeriSilicon has built a strong presence in Microcontroller Units (MCUs), in-cabin systems, and intelligent driving technologies. Leveraging our ISO 26262 compliant design processes, IPs, and comprehensive software services, we have successfully delivered custom intelligent driving chips based on advanced automotive-grade process technology to our customers. We are also progressing with the development of Chiplet solutions for intelligent driving. Moving forward, VeriSilicon will continue driving innovation in the automotive sector, contributing to greater safety and intelligence to the industry.”



 Àüü´º½º¸ñ·ÏÀ¸·Î

Geoswift Integrates with Circle Payments Network to Offer Stablecoin-Powered Real-Time Settlements in Cross-Border Payments
LG Brings the Spirit of Life¡¯s Good to Communities Across Indonesia
Qorium Secures ¢æ22m Investment to Accelerate Cultivated Leather Commercialisation
Corpay Cross-Border Named the Official FX Partner for BLAST
Carbon Measures and International Chamber of Commerce Launch Technical Expert Panel on Carbon Accounting
Rochester Electronics Delivers In-Stock Nexperia Products to Support Global Supply Continuity
Convera Executives Take the Stage at Money 20/20 USA to Share Vision for Secure, Borderless B2B Payments

 

CMA Amends Investment Rules to Boost Foreign Access and Market Efficie...
Xsolla Named ¡°Payment Service Provider of the Year¡± at the 2025 Gami...
MultiBank and Khabib Launch Global Venture to Build First Regulated To...
Tecnotree Recognized as a Major Player by IDC MarketScape 2025
Thredd Enters the Credit Space Partnering with LoanPro to Power Next-G...
Columbia Sportswear Names Co-Presidents Peter J. Bragdon and Joseph P....
NIQ Publishes 2025 ESG Progress Report: Advancing Integrity, Innovatio...

 


°øÁö»çÇ×
´º½ºÁö ÇÑÀÚ Ç¥±â¿¡ ´ë¸¸½Ä À½Â÷ Ç¥±â '纽ÞÙó¢ ´Ï¿ì½ÃÁö' º´±â
º£³×ÇÁ·Ò º£³×ÀÎÅõ Áß¹® Ç¥±â 宝Ò¬ÜØÙÌ 宝Ò¬ì×öõ(ÜÄÒ¬ÜØÙÌ ÜÄ...
¹Ìµð¾î¾Æ¿ì¾î Mediaour ØÚ体ä²们 ØÚô÷ä²Ùú MO ¿¥¿À ØÚä² ØÚä²
¾Ë¸®¿ìºê Alliuv ä¹备: ä¹联êó备, ¾Ë¶ã Althle ä¹÷åìÌ
¾Ë¸®¾Ë Allial Áß¹® Ç¥±â ä¹××尔 ä¹××ì³
´ºÆÛ½ºÆ® New1st Áß¹® Ç¥±â 纽ììãæ(¹øÃ¼ Òïììãæ), N1 纽1
¿£ÄÚ½º¸ð½º : À̾¾ 'EnCosmos : EC' Áß¹® Ç¥±â ì¤ñµ
¾ÆÀ̵ð¾î·Ð Idearon Áß¹® Ç¥±â ì¤îè论 ì¤îèÖå
¹ÙÀÌ¿ÀÀÌ´Ï Bioini Áß¹® Ç¥±â ù±药研 ù±å·æÚ
¿À½ºÇÁ·Ò Ausfrom 奥ÞÙÜØÙÌ, À£ÇÁ·Ò Welfrom 卫ÜØÙÌ
¿¡³ÊÇÁ·Ò Enerfrom 额ÒöÜØÙÌ ¿¡³ÊÀ¯ºñ Eneruv 额Òöêó备
¾ËÇÁ·Ò Alfrom Áß¹® Ç¥±â ä¹尔ÜØÙÌ ä¹ì³ÜØÙÌ

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇѰè¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, ÆÑ½º 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..