2025³â 12¿ù 14ÀÏ ÀÏ¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Science & Technology

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýȰ

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óǰ

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

Quectel Unveils Advanced Matter over Thread Modules for Seamless Device Interoperability

´º½ºÀÏÀÚ: 2025-12-14

BELGRADE, SERBIA -- Quectel Wireless Solutions, an end-to-end global IoT solutions provider, announced the launch of the KGM133S, the first in a range of Matter over Thread modules that provides innovative solutions for applications such as smart door locks, sensors, and lighting, helping the smart home industry overcome connectivity barriers and advance toward a new era of more efficient and seamless development.

The KGM133S series modules are built based on the Silicon Labs EFR32MG24 chip, supporting the latest Matter 1.4 protocol. The modules are designed to enable seamless linkage of home devices across ecosystems, including Apple Home, Google Home, Amazon Alexa and Samsung SmartThings.

“Protocol fragmentation remains one of the biggest obstacles to seamless smart device connectivity, and the Matter protocol is the key to overcoming it,” said Delbert Sun, Deputy General Manager at Quectel Wireless Solutions. “With our new Matter over Thread modules, we are helping the industry achieve true interoperability. Looking ahead, Quectel will continue to focus on comprehensive connectivity for smart homes, working closely with ecosystem partners to accelerate industry transformation and enhance everyday user experiences.”

Leveraging the powerful combination of Matter and Thread, Quectel’s KGM133S series delivers robust, scalable connectivity to power all-scenario IoT solutions. Built on the IEEE 802.15.4 standard, Thread natively supports globally unique IPv6 addressing, enabling seamless IP-based connectivity. Unlike Zigbee, Thread devices don’t rely on gateways for complex protocol conversions - they connect directly to the Internet via a Border Router, simplifying network architecture and dramatically reducing latency. With its core advantages of low power consumption and high reliability, Thread has become a cornerstone technology for the Matter ecosystem.

The KGM133S series features 256KB SRAM and offers three Flash capacity options: 1536KB, 2.5MB, and 3.5MB. This not only meets the development needs of various current smart home applications but also reserves sufficient space for future version upgrades and function expansion of the Matter protocol, ensuring that end products maintain long-term market competitiveness.

With outstanding performance, ultra-low power consumption, and a compact design, the KGM133S series stands out as a well-rounded solution built to meet the demands of a wide range of IoT applications.

· High Performance: Modules in this series feature an ARM Cortex-M33 processor with a maximum frequency of 78MHz, enabling efficient processing of complex data instructions.
· Low Power Consumption: In terms of power consumption, based on the 802.15.4 Thread protocol, they adopt a low-power design, making them well-suited for battery-powered devices.
· Small Size: The modules are offered in LGA packaging with two size options: 12.5 × 13.2 × 2.2 mm (KGM133S), featuring a fourth-generation IPEX or pin antenna, and 12.5 × 16.6 × 2.2 mm (KGM133S-P), equipped with an onboard PCB antenna. This flexibility enables seamless integration into a wide range of compact and slim terminal designs, supporting diverse structural requirements.
· Multiple Interfaces: Supporting up to 26 GPIOs that can be multiplexed as I²C, UART, SPI, or I²S interfaces, the module enables seamless integration with a wide range of peripherals, meeting the development requirements of feature-rich devices.
· High Power: With a receiving sensitivity better than -105 dBm and an optional maximum transmit power of 19.5 dBm, the module maintains stable, reliable signal transmission even in complex environments with walls or multi-device interference.
· Ultra-Wide Temperature Range: Supporting an ultra-wide operating temperature range of -40 to +105°C, the module series can cope with extreme environments

In addition to supporting the Matter over Thread protocol, the KGM133S series also integrates Zigbee 3.0 and Bluetooth LE 6.0 providing developers with additional connectivity options. The series further incorporates the Secure Vault enhanced security feature, providing a higher level of protection for IoT devices and data.

With its outstanding performance and flexible adaptability, the KGM133S not only meets the urgent needs of current all-scenario connectivity in smart homes but also points out the direction for the future development of the industry. Next, Quectel Wireless Solutions will keep up with the industry development trend, continue to develop more Matter products that meet market needs, and inject a steady stream of innovative momentum into the smart home industry.



 Àüü´º½º¸ñ·ÏÀ¸·Î

Quectel Unveils Advanced Matter over Thread Modules for Seamless Device Interoperability
IQM Launches Halocene, a New Quantum Computer Product Line for Error Correction
NetApp Recognized as Winner of 2025 Microsoft Americas Partner of the Year for SDC Canada Category
YES Chosen to Supply Full Suite of Glass Panel Packaging Tools for AI and HPC by Top Infrastructure Provider
Xsolla Expands Fintech Tools to Boost Player Loyalty and Security for Game Developers This Holiday Season
InterSystems Launches HealthShare AI Assistant to Optimize Data Retrieval and Clinical Engagement with Conversational Intelligence
Korean AI and Digital Startups Expand U.S. Presence Through New Partnerships in New York

 

Registrar Corp Acquires CMC Medical Devices to Make Global Compliance ...
ClickHouse Partners with Japan Cloud to Establish ClickHouse K.K. and ...
Southeast Asia smartphone shipments slip 1% in 3Q25 as vendors face mo...
HistoSonics Announces Oversubscribed $250 Million Growth Financing
Celonis Partners with Databricks to Power Enterprise AI that Continuou...
Aptiv and Robust.AI to Co-Develop AI-Powered Collaborative Robots
Klook Files Registration Statement for Proposed Initial Public Offerin...

 


°øÁö»çÇ×
´º½ºÁö ÇÑÀÚ Ç¥±â¿¡ ´ë¸¸½Ä À½Â÷ Ç¥±â '纽ÞÙó¢ ´Ï¿ì½ÃÁö' º´±â
º£³×ÇÁ·Ò º£³×ÀÎÅõ Áß¹® Ç¥±â 宝Ò¬ÜØÙÌ 宝Ò¬ì×öõ(ÜÄÒ¬ÜØÙÌ ÜÄ...
¹Ìµð¾î¾Æ¿ì¾î Mediaour ØÚ体ä²们 ØÚô÷ä²Ùú MO ¿¥¿À ØÚä² ØÚä²
¾Ë¸®¿ìºê Alliuv ä¹备: ä¹联êó备, ¾Ë¶ã Althle ä¹÷åìÌ
¾Ë¸®¾Ë Allial Áß¹® Ç¥±â ä¹××尔 ä¹××ì³
´ºÆÛ½ºÆ® New1st Áß¹® Ç¥±â 纽ììãæ(¹øÃ¼ Òïììãæ), N1 纽1
¿£ÄÚ½º¸ð½º : À̾¾ 'EnCosmos : EC' Áß¹® Ç¥±â ì¤ñµ
¾ÆÀ̵ð¾î·Ð Idearon Áß¹® Ç¥±â ì¤îè论 ì¤îèÖå
¹ÙÀÌ¿ÀÀÌ´Ï Bioini Áß¹® Ç¥±â ù±药研 ù±å·æÚ
¿À½ºÇÁ·Ò Ausfrom 奥ÞÙÜØÙÌ, À£ÇÁ·Ò Welfrom 卫ÜØÙÌ
¿¡³ÊÇÁ·Ò Enerfrom 额ÒöÜØÙÌ ¿¡³ÊÀ¯ºñ Eneruv 额Òöêó备
¾ËÇÁ·Ò Alfrom Áß¹® Ç¥±â ä¹尔ÜØÙÌ ä¹ì³ÜØÙÌ

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇѰè¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, ÆÑ½º 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..